Semicon

Trends in semicon

Since its inception, the semicon market has seen exponential growth in the computing power of chips – Moore’s law. This is currently driven, among other things, by the emergence of 5G and cloud and IOT applications. In addition, the integration of a wide variety of sensors is increasing. This is leading to the emergence of the next generation of chips with new packaging techniques, complex 3D architectures and exotic materials.

Developers of production machines are continuing to focus on increasing productivity and reducing costs, for example by building bridges between the production and metrological process and using machine learning for controlled and predictable processes. With new technologies such as virtual and augmented reality, design processes can be optimized and installation and maintenance can be controlled remotely. Sioux supports OEMs in solving all these challenges.

Solutions

Sioux has enormous expertise in inspection systems, accurate positioning, extreme process conditions and handling and integration of new materials. In addition, we have exceptional competencies in data management and the creation of tools for qualification and testing. During the realization of complete machines or partial solutions, we use various advanced methodologies: model based systems engineering, hardware and software in the loop. This guarantees a shorter time-to-market and an optimal cost of ownership, from design to end of life.